Considering the presence of an 8-core Zen 2 CPU and 10.28 TFLOP-capable RDNA 2 GPU from AMD in the PS5 console, it’s hardly surprising that an efficient cooling solution was always going to be a pre-requisite.

Recent rumors about the next-gen console have stated that such a cooling system was already in place, although an older post about the PS5 led many to wonder if Sony was struggling with keeping the PS5’s heating under control – to the point that some even believed a console redesign was on the cards.

This PS5 devkit cooling solution patent now proves that Sony was on top of the potentially problematic issue for a long time, and it gives some credence to the “leak” that the final PS5 design will be of a “thick” console, to contain all the necessary parts that make up the efficient cooling system.